Semiconductor structures and method for fabricating the same

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United States of America Patent

PATENT NO 8877323
SERIAL NO

12956209

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Abstract

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A semiconductor structure is provided. The semiconductor structure includes a first substrate, a second substrate opposite to the first substrate, a plurality of spacers disposed between the first substrate and the second substrate, and an adhesive material bonded with the first substrate and the second substrate within the two adjacent spacers. The invention also provides a method for fabricating the semiconductor structure.

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Patent Owner(s)

Patent OwnerAddress
HIMAX TECHNOLOGIES LIMITEDNO 26 ZIH LIAN ROAD FONGHUA VILLAGE SINSHIH TOWNSHIP TAINAN COUNTY 74148 R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Tsung-Chieh Sinshih Township, Tainan County, TW 21 187
Ko, Ching-Hung Sinshih Township, Tainan County, TW 5 25
Liu, Mu-Jia Sinshih Township, Tainan County, TW 2 11

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