HIGH SPEED, HIGH RESOLUTION, THREE DIMENSIONAL PRINTED CIRCUIT BOARD INSPECTION SYSTEM
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United States of America Patent
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N/A
app pub date -
Dec 1, 2011
filing date -
Sep 22, 2009
priority date (Note) -
Abandoned
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Abstract
An optical inspection system includes a printed circuit board (PCB) transport and an illuminator that provides at least a first strobed illumination field. The illuminator includes a light pipe having a first end proximate the PCB, and a second end opposite the first end and spaced from the first end. An array of cameras is configured to digitally image the PCB and to generate a plurality of images of the PCB with the at least first strobed illumination field type. At least one structured light projector is disposed to project structured illumination on the PCB. The at least one array of cameras is configured to digitally image the PCB while the PCB is illuminated with structured light, to provide a plurality of structured light images. A processing device is configured to generate an inspection result as a function of the plurality of images and the plurality of structured light images.
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