WIRE FEEDING APPARATUS FOR WIRE BONDERS

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United States of America Patent

SERIAL NO

12956068

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Abstract

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A wire bonder comprises a bonding tool for forming wire bonds and a pneumatic device for feeding wire to the bonding tool. An upper clamp and a lower clamp are aligned along a wire feeding route between the pneumatic device and the bonding tool to clamp the wire at respective clamping points. A fixed intermediate guiding chamber extends substantially from the upper clamp to the lower clamp. The said intermediate guiding chamber encloses the wire along the wire feeding route and is operative to shield and guide the wire.

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Patent Owner(s)

Patent OwnerAddress
ASM TECHNOLOGY SINGAPORE PTE LTDSINGAPORE SHUN SHUN ROAD 2 NO 7 SINGAPORE CITY SINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Xiao Liang Singapore, SG 10 49
SONG, Keng Yew James Singapore, SG 7 34
ZHANG, Yue Singapore, SG 291 1641

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