HIGH-THERMAL-CONDUCTIVITY POLYCARBONATE RESIN COMPOSITION AND FORMED PRODUCT
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United States of America Patent
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Issued Date -
May 24, 2012
app pub date -
Jun 23, 2011
filing date -
Jul 21, 2010
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Abandoned
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Abstract
To provide a high-thermal-conductivity polycarbonate resin composition that has further improved thermal conductivity and even insulating properties and flame resistance, and a formed product thereof. A high-thermal-conductivity polycarbonate resin composition, containing: 100 parts by mass of an (A) resin component mainly composed of a polycarbonate resin; 5 parts by mass or more and 100 parts by mass or less of (B) graphitized carbon fiber having a longitudinal thermal conductivity of 100 W/m K or more and an average fiber diameter in the range of 5 to 20 μm; and 5 parts by mass or more and 200 parts by mass or less of glass beads having an average particle size in the range of 1 to 100 μm and a sphericity in the range of 1 to 2.
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