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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ULTRATECH INC	3050 ZANKER ROAD SAN JOSE CA 95134

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• 2012 Application Filing Year
• H01L Class
• 20465 Applications Filed
• 18077 Patents Issued To-Date
• 88.34 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
ANDERSON, Felix P	Colchester, US	20	199
# of filed Patents : 20 Total Citations : 199
COTE, William	Poughquag, US	12	89
# of filed Patents : 12 Total Citations : 89
EDELSTEIN, Daniel C	White Plains, US	303	6461
# of filed Patents : 303 Total Citations : 6461
MCDEVITT, Thomas L	Underhill, US	61	931
# of filed Patents : 61 Total Citations : 931
STAMPER, Anthony K	Williston, US	615	6820
# of filed Patents : 615 Total Citations : 6820

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Patent Citation Ranking

• 0 Citation Count
• H01L Class

• 0 % this patent is cited more than
• 13 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2012/0129,336

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

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Abstract

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Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a trench formed in a dielectric layer which has at least a portion thereof devoid of a fluorine boundary layer. The structure further includes a copper wire in the trench having at least a bottom portion thereof in contact with the non-fluoride boundary layer of the trench. A lead free solder bump is in electrical contact with the copper wire.

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