HIGH-TEMPERATURE SEALING
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United States of America Patent
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Issued Date -
May 24, 2012
app pub date -
Apr 16, 2011
filing date -
Jun 8, 2010
priority date (Note) -
Abandoned
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Abstract
The invention relates to a high temperature sealing, including the following features:
- a ceramic refractory sealing mass,an envelope surrounding the said refractory sealing mass,the envelope decomposes at temperatures between >50 and <2.000° C. andforms a carbon layer, after its decomposition, along the surface of the ceramic sealing mass.
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