IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM
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United States of America Patent
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Issued Date -
May 24, 2012
app pub date -
Nov 10, 2011
filing date -
Nov 23, 2010
priority date (Note) -
Abandoned
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Abstract
A method of imaging a feature of a semiconductor device is provided. The method includes the steps of: (a) imaging a first portion of a semiconductor device to form a first imaged portion; (b) imaging a subsequent portion of the semiconductor device to form a subsequent imaged portion; (c) adding the subsequent imaged portion to the first imaged portion to form a combined imaged portion; and (d) comparing the combined imaged portion to a reference image of a feature to determine a level of correlation of the combined imaged portion to the reference image.
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