Contact Array for Substrate Contacting
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 24, 2012
app pub date -
Nov 5, 2009
filing date -
Apr 8, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention relates to a contact arrangement (47, 48, 49, 50, 55, 56, 57) for substrate contacting, in particular for contacting terminal faces of a semiconductor substrate (21), comprising at least one inner contact (25) of the contact arrangement that is formed on a substrate surface by a base terminal face of the substrate, a passivation layer (34, 35) covering at least the outer edge region and the periphery of the inner contact, at least one lower contact strip (36) extending laterally away from the inner contact (25) on the passivation layer (34, 35), and a further, upper contact strip (37, 38, 39) extending on the lower contact strip, wherein the further contact strip is formed by a contact metallization, which is substantially composed of a nickel (Ni) layer or a layer structure (38, 39) containing nickel and palladium (Pd).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully