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United States of America Patent

APP PUB NO 20120126384A1
SERIAL NO

13231967

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention employs tie bar(s) of a lead frame as contact(s) so as to increase the number of contacts in a package structure. Therefore, a die can be packaged in a package structure with a smaller dimension to lower packaging cost of an integrated circuit.

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Patent Owner(s)

Patent OwnerAddress
GREEN SOLUTION TECHNOLOGY CO LTD6F NO 366 GONGJIAN RD XIZHI CITY TAIPEI COUNTY 221 R O C

International Classification(s)

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  • 2011 Application Filing Year
  • H01L Class
  • 19146 Applications Filed
  • 15997 Patents Issued To-Date
  • 83.56 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20112012201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MENG, Shang-Shin New Taipei City, TW 1 9

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Patent Citation Ranking

  • 9 Citation Count
  • H01L Class
  • 3.37 % this patent is cited more than
  • 13 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges234326114937383772491639770504017801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +020040060080010001200140016001800200022002400260028003000320034003600

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