Low lead ingot
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Oct 28, 2011
filing date -
Oct 29, 2010
priority date (Note) -
Abandoned
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Abstract
A composition for a low lead ingot comprising primarily copper and including tin, zinc, sulfur, phosphorus, nickel. The composition may contain manganese. The low lead ingot, when solidified, includes sulfur or sulfur containing compounds such as sulfides distributed through the ingot. The presence and a substantially uniform distribution of these sulfur compounds imparts improved machinability and better mechanical properties.
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