LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Jul 13, 2011
filing date -
Nov 17, 2010
priority date (Note) -
Abandoned
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Abstract
An LED package structure with a deposited-type phosphor layer includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes at least one circuit substrate. The light-emitting unit includes a plurality of LED chips disposed on and electrically connected to the at least one circuit substrate. The package unit includes at least one package resin body formed by a mold structure. The at least one package resin body is formed on the at least one circuit substrate to cover the LED chips, and the at least one package resin body includes a continuous phosphor layer formed therein and deposited on outer surfaces of the LED chips by centrifugal force. Hence, the instant disclosure provides the continuous phosphor layer with the deposited phosphor powders for covering the outer surfaces of the LED chips, thus the light-emitting efficiency of the LED package structure can be increased actually.
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