Method for Electrodeposition of an Electrode on a Dielectric Substrate
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Oct 31, 2011
filing date -
Nov 15, 2010
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Abandoned
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Abstract
A method for the electrodeposition of an electrode including a metallic electrode material (40) on a dielectric substrate (10), including the following steps: depositing an electrically conductive polymer layer (20); masking the electrically conductive polymer layer (20) using a mask; electrodepositing the metallic electrode material (40) on the electrically conductive polymer layer (20); removing the mask; and removing or deactivating the excess conductive polymer layer (20).
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