SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Nov 11, 2011
filing date -
Nov 12, 2010
priority date (Note) -
Abandoned
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Abstract
The device for extracting heat from carbon nanotubes wires or cables used under high power applications is provided. The device can include a thermally conductive member for placement against a heat source and for directing heat away from the heat source to a heat dissipating medium. The device can further include an electrically conductive member positioned on the thermally conductive member and made from a layer of carbon nanotubes, to reduce electrical resistance along the electrically conductive member. A geometric pattern can be imparted to the electrically conductive member to enhance dissipation of heat away from the thermally conductive member and the heat source.
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