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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
STIEFEL LABORATORIES INC	251 LITTLE FALLS DRIVE WILMINGTON DE 19808

International Classification(s)

• A61K:PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOS....
• C07D:HETEROCYCLIC COMPOUNDS
• A61P:THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDI....

• 2010 Application Filing Year
• A61K Class
• 10962 Applications Filed
• 7633 Patents Issued To-Date
• 69.64 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Bishop, Michael J	Research Triangle Park, US	41	346
# of filed Patents : 41 Total Citations : 346
Cai, Xin Frank	Palo Alto, US	3	1
# of filed Patents : 3 Total Citations : 1
Chern, Wendy Huang	Palo Alto, US	6	1
# of filed Patents : 6 Total Citations : 1
Colborn, Alan	Research Triangle Park, US	3	1
# of filed Patents : 3 Total Citations : 1
Ge, Xue	Palo Alto, US	4	1
# of filed Patents : 4 Total Citations : 1
Hofland, Hans	Palo Alto, US	14	97
# of filed Patents : 14 Total Citations : 97
Wong, Hansen	Sunnyvale, US	6	5
# of filed Patents : 6 Total Citations : 5

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Patent Citation Ranking

• 1 Citation Count
• A61K Class

• 12.01 % this patent is cited more than
• 13 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2018/0019,173

SEMICONDUCTOR DEVICE AND CASING OF THE SEMICONDUCTOR DEVICE

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Abstract

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A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.

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Description

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