BONDING SHEET

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United States of America Patent

APP PUB NO 20120114934A1
SERIAL NO

13319845

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a bonding sheet including: an adhesive layer of an adhesive composition having a high-molecular weight component (A) and a thermosetting component (B) formed into a sheet, wherein a ratio (PCN/PCO) of a peak height near 2240 cm−1 derived from a nitrile group (PCN) to a peak height near 1730 cm−1 derived from a carbonyl group (PCO) is 0.03 or less in an IR spectrum of the high-molecular weight component (A).

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Patent Owner(s)

Patent OwnerAddress
HITACHI CHEMICAL COMPANY LTDCHIYODA-KU TOKYO 100-6606

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwakura, Tetsurou Ibaraki, JP 15 188
Kodama, Megumi Chiba, JP 3 3
Tokuyasu, Takahiro Chiba, JP 7 14

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