HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE
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United States of America Patent
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Issued Date -
May 10, 2012
app pub date -
Nov 4, 2010
filing date -
Nov 4, 2010
priority date (Note) -
Abandoned
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Abstract
A high bandwidth semiconductor printed circuit board assembly (PCBA) providing a layer of dielectric substrate containing plated vias with an upper and lower surface plated with etched copper, mated with a second layer of etched copper plated dielectric containing plated vias that is placed on the top surface of the first layer. A third layer of etched copper plated dielectric containing plated vias may be placed on the bottom layer of etched copper foil. A base layer of etched copper plated thick dielectric containing plated vias is laminated simultaneously with the preceding layers to provide the high bandwidth digital and RF section of the assembly.
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