LEAD-FREE SOLDER

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

13352984

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

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Patent Owner(s)

Patent OwnerAddress
FUJI ELECTRIC DEVICE TECHNOLOGY CO LTD1-11-2 OSAKI SHINAGAWA-KU TOKYO
ASAMI MAKOTOC/O NIHON HANDA CO LTD 29-4 TAIHEI 1-CHOME SUMIDA-KU TOKYO 130-0012

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ASAGI, Takeshi Tokyo, JP 6 29
HIRAI, Masatoshi Tokyo, JP 6 28
ICHINOSE, Masaki Tokyo, JP 4 6
MAKITA, Kazuyuki Tokyo, JP 5 13
MURATA, Toru Tokyo, JP 10 23
SOUTOME, Masayuki Tokyo, JP 11 122
WATASHIMA, Taketo Tokyo, JP 3 6
YAMASHITA, Mitsuo Tokyo, JP 85 827

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