ELECTRONIC CIRCUIT COMPRISING A TRANSFER FACE ON WHICH CONTACT PADS ARE LAID OUT
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United States of America Patent
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Issued Date -
May 10, 2012
app pub date -
Nov 10, 2011
filing date -
Nov 10, 2010
priority date (Note) -
Abandoned
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Abstract
An electronic circuit includes a transfer face and a plurality of contact pads. The pads include a first set of pads of a first type in a central zone at the center of the transfer face; second sets of pads of the first type on an end portion of a diagonal of the transfer face; third sets of pads of a second type on a median portion of a diagonal of the transfer face; fourth sets of pads of a third type in a lateral zone demarcated by the central zone and two semi-diagonals joined by one side of the transfer face. Each pad of the first type has a greater surface area on the transfer face than each pad of the second type, and each pad of the second type has a greater surface area than each pad of the third type.
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