ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
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United States of America Patent
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Issued Date -
May 3, 2012
app pub date -
Nov 9, 2011
filing date -
Jun 14, 2005
priority date (Note) -
Abandoned
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Abstract
An electrically conductive interconnect system has a post, extending above a supporting surface, the post including a rigid material, a coating on the rigid material, wherein the post and has a first width at the supporting surface and a second width at a distance removed from the supporting surface, and the post narrows from the first width to the second width. A method of electrically connecting a portion of a first supporting surface to a portion of a second supporting surface involves bringing a post on the first supporting surface into contact with an electrically conductive material located on the second supporting surface, softening the electrically conductive material, causing a separation distance between the first supporting surface and the second supporting distance to decrease so that a portion of the post will be surrounded by the electrically conductive material, and allowing the temperature of the electrically conductive material to decrease.
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