METHOD FOR PRODUCING FORMED CIRCUIT COMPONENT
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United States of America Patent
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Issued Date -
May 3, 2012
app pub date -
Jul 6, 2010
filing date -
Jul 10, 2009
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Abandoned
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Abstract
Disclosed is a method for producing a formed circuit component, wherein the surface of a substrate is roughened by being irradiated with laser ray instead of being etched using a chemical agent, thereby assuring sufficient adhesive strength with an electroless plating. Specifically disclosed is a method for producing a formed circuit component, which comprises: a first step of forming a substrate (1); a second step of radiating a first laser ray (2) and thereby roughening either a surface of the substrate (1) or only a circuit forming region (1a) of the substrate surface; a third step of applying a catalyst (3) to the surface of the substrate (1); a fourth step of drying the substrate (1); a fifth step of radiating a second laser ray (4), thereby lowering or eliminating the function of the catalyst (3) on a non-circuit forming region (1b); and a sixth step of electroless-plating the circuit forming region (1a) of the substrate surface.
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