METHOD OF COATING AN RF DEVICE AND SPUTTERING APPARATUS USED IN THE SAME

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United States of America Patent

APP PUB NO 20120103794A1
SERIAL NO

13282113

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Abstract

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A method of coating an RF device for reducing cost of manufacture and coating period of time and a sputtering apparatus used in the same are disclosed. The sputtering apparatus used for coating of an RF device includes a supporting member on which an object to be coated corresponding to the RF device is placed, a first target made up of material coated on the object and a second target disposed separately from the first target. Here, power is applied to the first target and the second target when the object is coated.

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Patent Owner(s)

Patent OwnerAddress
ACE TECHNOLOGIES CORPORATION24B-5L 451-4 NONHYUN-DONG NAMDONG-GU INCHEON-SI 405-849

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JUNG, Hyun-Yeong Gwangju-si, KR 2 1
JUNG, Myoung-Joon Gyeonggi-Do, KR 2 1
KIM, Myoung-Ho Gwangju-si, KR 13 95
OH, Se-Young Incheon-si, KR 18 217

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