METHODS AND APPARATUS FOR CUTTING PROFILES

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United States of America Patent

APP PUB NO 20120103155A1
SERIAL NO

13133135

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device, comprising: a base plate configured to be moveable toward and back from a metal rule having at least one flanged side, wherein the metal rule is fed into the device along a metal rule feeding path; a first plate coupled to the base plate, the first plate including a plurality of cutter holes formed on its surface; a plurality of cutting elements configured to engage the corresponding plurality of cutter holes on the first plate to make cuts on the at least one flanged side of the metal rule.

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Patent Owner(s)

Patent OwnerAddress
SEOUL LASER DIEBOARD SYSTEM CO LTD27171 BURBANK FOOTHILL RANCH CA 92610

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Sang Moo San Diego, US 38 77

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