METHODS AND APPARATUS FOR CUTTING PROFILES

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United States of America Patent

APP PUB NO 20120103050A1
SERIAL NO

13133133

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for cutting a profile, including: a cutter configured to make cuts on the profile having a first surface and a second surface, and having at least one rib on the first surface, wherein the cuts are made on the first surface of the profile; a first drive unit to drive the cutter forward and backward to and from the first surface of the profile; and a second drive unit to drive the cutter up and down along the first surface of the profile.

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Patent Owner(s)

Patent OwnerAddress
SEOUL LASER DIEBOARD SYSTEM CO LTD27171 BURBANK FOOTHILL RANCH CA 92610

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Sang Moo San Diego, US 38 77

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