MICROMETRIC DIRECT-WRITE METHODS FOR PATTERNING CONDUCTIVE MATERIAL AND APPLICATIONS TO FLAT PANEL DISPLAY REPAIR
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United States of America Patent
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Issued Date -
Apr 26, 2012
app pub date -
Oct 24, 2011
filing date -
Aug 26, 2002
priority date (Note) -
Abandoned
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Abstract
A method for direct-write patterning comprises providing a cantilever having a cantilever end, wherein the cantilever is a tipless cantilever; providing an ink disposed at the cantilever end; providing a substrate surface; and moving the cantilever end or moving the substrate surface so that ink is delivered from the cantilever end to the substrate surface. A method for direct writing of conductive metal or metal precursor comprises providing a tipless cantilever having a cantilever end; providing an ink disposed at the cantilever end, wherein the ink comprises one or more metals, one or more metallic nanoparticles, or one or more metal salts; providing a substrate surface; and contacting the cantilever end and the substrate surface so that ink is delivered from the cantilever end to the substrate surface.
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