SERIALLY-CONNECTED HEAT-DISSIPATING FIN ASSEMBLY
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United States of America Patent
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Issued Date -
Apr 26, 2012
app pub date -
Oct 22, 2010
filing date -
Oct 22, 2010
priority date (Note) -
Abandoned
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Abstract
A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders.
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