Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same

United States of America Patent

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Issued Date
Apr 26, 2012
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May 20, 2011
filing date
May 21, 2010

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Abandoned

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Abstract

The present invention is directed to stencils for high-throughput, high-resolution etching of substrates and processes of making and using the same.

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NANO TERRA INC	790 MEMORIAL DRIVE SUITE 202 CAMBRIDGE MA 02139

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Inventor Name	Address	# of filed Patents	Total Citations
BLANCHET, Graciela Beatriz	Boston, US	31	551
GILLIES, Jennifer	Cambridge, US	14	455
HUNTING, Lindsay	Cambridge, US	2	5
KÜGLER, Ralf	Cambridge, US	4	14
MAYERS, Brian T	Arlington, US	22	703
MCLELLAN, Joseph M	Quincy, US	19	733
REUST, Patrick	Somerville, US	9	47
STERN, Eric	Cambridge, US	44	530

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Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13112166

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13112166

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