Wafer Level Package and Manufacturing Method Using Photodefinable Polymer for Enclosing Acoustic Devices
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United States of America Patent
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Issued Date -
Apr 19, 2012
app pub date -
Oct 18, 2010
filing date -
Oct 18, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer level package is produced by forming a photo definable polymer into a frame structure around a device located on a device wafer while maintaining the polymer in a partially cured state. Additional polymer material is used form a cap structure on a carrier wafer. The cap structure is attached to the frame structure so as to place the device within a cavity, wherein sufficient pressure is applied to the cap structure to hold the frame structure via a bonding of the partially cured photo definable polymers. The bonding is characterized by adhesion strength greater than the adhesion strength securing the cap structure to the carrier wafer. The carrier wafer is separated from the device wafer with a force sufficient for separating the carrier wafer from the cap structure while the cap structure remains attached to the frame structure.
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