DEVICE FOR CHARACTERISING ELECTRIC OR ELECTRONIC COMPONENTS
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United States of America Patent
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Issued Date -
Apr 19, 2012
app pub date -
Dec 22, 2009
filing date -
Dec 24, 2008
priority date (Note) -
Abandoned
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Abstract
The invention relates to an integrated device (PM) for characterising electric or electronic components (DUT), in particular nanometric ones, comprising a substantially insulating substrate (S) on which are provided four conducting pads (P1, P2, P3, P4), at least three resistive pads (R1, R3, R4) connecting said pads together, and a transmission line (CPW) including a signal conductor (Cc) and at least one ground conductor (CL1, CL2), wherein: said resistive pads are arranged so as to connect a first conducting pad to a second and a fourth conducting pad, and to connect said fourth conducting pad to a third conducting pad; the signal conductor of the transmission line is connected to the first conducting pad; and the ground conductor of the transmission line is connected to the third pad.
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