Diced Wafer Adaptor and a Method for Transferring a Diced Wafer
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United States of America Patent
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N/A
Issued Date -
Apr 12, 2012
app pub date -
Jan 25, 2007
filing date -
Jan 27, 2006
priority date (Note) -
Abandoned
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Abstract
A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer.
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