CONDUCTION COOLED PACKAGE LASER AND PACKAGING METHOD FOR FORMING THE SAME
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United States of America Patent
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Issued Date -
Apr 5, 2012
app pub date -
Mar 28, 2011
filing date -
Sep 30, 2010
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Abstract
A packaging method for forming a conduction cooled package (CCP) laser is provided and includes soldering a semiconductor laser device on the first heat spreader; and then bonding the first heat spreader on the second spreader via an Al/Ni nano-laminated foil. Moreover, a CCP laser is also provided herein.
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