PRINTED WIRING BOARD WITH BUILT-IN COMPONENT AND ITS MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Apr 5, 2012
app pub date -
Sep 16, 2011
filing date -
Oct 5, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A printed wiring board with components and its manufacturing method is described. An opening is formed from one main surface to another main surface of a core material. A functional element is brought into press contact with the side wall of the opening such that terminals of the functional element are exposed facing the core material's one main surface and the other main surface. A first and second interlayer dielectric layers are formed on the main surface and the other main surface, respectively, each interlayer dielectric layer having conductive bumps connected to conductive layers, with the interlayer dielectric layers filling voids between the opening and the functional element. A first terminal and a second terminal of the functional element are connected to respective first and second conductive bumps, respectively.
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