Method of Contacting a Semiconductor Substrate
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United States of America Patent
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app pub date -
Oct 28, 2011
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May 5, 2009
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Abandoned
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Abstract
A method is disclosed for making contact with a semiconductor substrate, in particular for making contact with solar cells, in which a metallic seed structure is generated on the surface through a dielectric or passivating layer by means of an LIFT process, and the seed structure is then reinforced.
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