PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS

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United States of America Patent

APP PUB NO 20120076949A1
SERIAL NO

13216785

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In applying an application liquid onto a substrate and forming a line-like pattern, discharging of the application liquid is initiated from an inward position X0 which is inward from an originally intended start position X1, while keeping the amount of the gap between a nozzle and the substrate to a smaller value G0 than the height of the pattern. Following this, the nozzle moves toward outside the substrate while moving away from the substrate, and the reverses its movement direction at the pattern start position X1. Near a posterior end as well, the nozzle moves closer to the substrate while reducing the discharged quantity of the application liquid, and the movement direction is reversed while moving the nozzle away at a pattern end position X3.

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Patent Owner(s)

Patent OwnerAddress
DAINIPPON SCREEN MFG CO LTDKYOTO JAPAN KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FURUICHI, Koji Kyoto, JP 9 11
IWASHIMA, Masanobu Kyoto, JP 4 9
SANADA, Masakazu Kyoto, JP 51 579

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