SYSTEMS HAVING INTEGRATED MECHANICAL RESONATING STRUCTURES AND RELATED METHODS
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United States of America Patent
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Issued Date -
Mar 29, 2012
app pub date -
Jul 27, 2011
filing date -
Jul 27, 2010
priority date (Note) -
Abandoned
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Abstract
Devices including integrated components are described. The components may be integrated by being formed on a single substrate. The components may be integrated by being formed on separate chips within a multi-chip module. The components being integrated may include mechanical resonating structures, which in some instances may be piezoelectric mechanical resonating structures.
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