BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS
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United States of America Patent
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Issued Date -
Mar 29, 2012
app pub date -
Sep 27, 2010
filing date -
Sep 27, 2010
priority date (Note) -
Abandoned
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Abstract
One aspect of the invention pertains to an arrangement for forming exposed die packages. The arrangement includes a semiconductor wafer having multiple integrated circuit dice whose back surfaces cooperate to form the back surface of the wafer. A thermally conductive adhesive layer is deposited on the back surface of the wafer. The metal foil is attached to the wafer with the adhesive layer. Methods of forming exposed die packages using the above arrangement are also described.
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