IRIDIUM PLATING SOLUTION AND METHOD OF PLATING USING THE SAME

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United States of America Patent

APP PUB NO 20120073980A1
SERIAL NO

12893454

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Proposed are an iridium plating solution capable of easily forming an iridium plating coat in which the occurrence of cracks is suppressed as much as possible and an iridium plating method. In the present invention, the iridium plating solution uses an iridium compound obtained by adding, to an iridium (III) complex salt containing a halogen as an anionic component, one or more compounds selected from the following group and by stirring the resulting mixture, the group consisting of a saturated monocarboxylic acid, a saturated monocarboxylic acid salt, a saturated dicarboxylic acid, a saturated dicarboxylic acid salt, a saturated hydroxycarboxylic acid, a saturated hydroxycarboxylic acid salt, an amide and urea, wherein the iridium plating solution includes at least one or more of Fe, Co, Ni and Cu.

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Patent Owner(s)

Patent OwnerAddress
ELECTROPLATING ENGINEERS OF JAPAN LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ITO, MASAHIRO Hiratsuka-shi, JP 384 3615

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