INTEGRATED CIRCUIT ESD PROTECTION USING SUBSTRATE IN ESD CURRENT PATH
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 22, 2012
app pub date -
Sep 17, 2010
filing date -
Sep 17, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for conducting ESD current through an integrated circuit formed on a semiconductor substrate includes sensing an ESD potential between a first I/O pad and a second I/O pad of the integrated circuit, providing a current path for ESD current from the first I/O pad of the integrated circuit to a portion of a first metal line in the integrated circuit, providing a current path for ESD current from the portion of the first metal line to the substrate, and providing a current path for ESD current from the substrate to the second I/O pad of the integrated circuit.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully