VLSI Package for High Performance Integrated Circuit
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United States of America Patent
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Issued Date -
Mar 22, 2012
app pub date -
Sep 21, 2010
filing date -
Sep 21, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A packaged integrated circuit is presented for placement on a printed circuit board (PCB) layer providing power lines and data access channels. The packaged integrated circuit includes; a package substrate having data channels and power lines; a circuit substrate having functional components, wherein (a) the power lines and the data channels in the package substrate are coupled to the functional components of the substrate by conducting bumps, (b) the conducting balls coupling the data access channels in the PCB to the data channels in the package substrate are located along the edges of the package substrate; and (c) the conducting balls coupling the power lines in the PCB and the power lines in the package substrate are located in an interior portion of the package substrate. Also, an integrated circuit may further include a circuit substrate having active components, including a SerDes circuit at a center portion of the substrate.
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