PHASE CHANGE MEMORY DEVICE AND FABRICATION THEREOF

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United States of America Patent

SERIAL NO

13304187

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Abstract

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A method for forming a phase change memory device is disclosed. A substrate with a bottom electrode thereon is provided. A heating electrode and a dielectric layer are formed on the bottom electrode, wherein the heating electrode is surrounded by the dielectric layer. The heating electrode is etched to form recess in the dielectric layer. A phase change material is deposited on the dielectric layer, filling into the recess. The phase change material is polished to remove a portion of the phase change material exceeding the surface of the dielectric layer and a phase change layer is formed confined in the recess of the dielectric layer. A top electrode is formed on the phase change layer and the dielectric layer.

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Patent Owner(s)

Patent OwnerAddress
POWERCHIP SEMICONDUCTOR CORPNO 12 LI-HSIN RD I SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHUANG, Jen-Chi Hsinchu County, TW 9 17
HUANG, Ming-Jeng Taichung City, TW 12 14
LEE, Chien-Min Kaohsiung City, TW 210 1319
LIN, Jia-Yo Hsinchu City, TW 5 11
WANG, Min-Chih Taipei County, TW 7 26

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