Method of co-sputtering alloys and compounds using a dual C-MAG cathode arrangement and corresponding apparatus
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Sep 17, 2010
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Sep 17, 2010
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Certain example embodiments of this invention relate to techniques for sputter-depositing a thin film(s) including two or more materials using targets such as rotating cylindrical sputtering targets, including a method and apparatus. Magnet bar assemblies in first and second adjacent sputtering targets are oriented differently. The different orientations of the magnet bar assemblies allows material from the second target to be sputtered onto the first target, or vice versa. The mixture of material on the first target, including sputtering material from both the first and second targets, is then sputtered onto a substrate to form a sputter-deposited thin film that includes a mixture of the sputtering materials from the targets.
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