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United States of America Patent
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Issued Date -
Mar 22, 2012
app pub date -
Jun 14, 2010
filing date -
Jun 15, 2009
priority date (Note) -
Abandoned
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Abstract
An apparatus for carrying out atomic layer deposition onto a surface of a substrate by exposing the surface of the substrate to alternate starting material surface reactions, the apparatus including two or more low-pressure chambers, two or more separate reaction chambers arranged to be placed inside the low-pressure chambers, and at least one starting material feed system common to two or more low-pressure chambers for carrying out atomic layer deposition. The apparatus includes at least one loading device arranged to load and unload substrates to/from the reaction chamber and further to load and unload the reaction chambers to/from the low-pressure chambers.
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