Programmable anti-fuse wire bond pads
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
Sep 14, 2010
filing date -
Sep 14, 2010
priority date (Note) -
Abandoned
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Abstract
A mechanically programmable anti-fuse is configured in a thick, top metallic layer of a semiconductor. The metallic layer is selected of a material that possesses malleable properties. The metal anti-fuse programming pad is surrounded, either wholly or in part, by a pad segment. An intervening space between the anti-fuse pad and the pad segment is selected from a predetermined value such that capillary pressure, exerted when a ball-bond is placed atop the anti-fuse pad and the pad segment, causes the pads to deform and shorts to the anti-fuse pad to the pad segment. The shorting, created during the wire bonding process, programs the anti-fuse.
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