PASTE COMPOSITION USED FOR FORMING AN ELECTRODE OR WIRING WHICH IS CURABLE AT A LOW TEMPERATURE
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
Mar 30, 2010
filing date -
Apr 1, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention is directed to a paste composition used for forming an electrode or wiring, wherein it comprises a) a conductive powder; b) a cellulose binder; c) an acrylate monomer; d) a radical polymerization initiator; and e) a solvent, and it is curable at a low temperature when compared to the prior paste compositions and it has excellent hardness, electrical resistivity and stability so that it can be usefully used for forming an electrode or wiring for a solar cell, RFID (Radio Frequency Identification) or PCB (Printed Circuit Board).
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