METHOD AND DEVICE FOR THE ELECTROLYTIC TREATMENT OF HIGH-RESISTANCE LAYERS
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
May 18, 2010
filing date -
May 22, 2009
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Abandoned
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Abstract
A method and a device for electroplating and electrolytically etching plate-shaped or strip-shaped material in continuous installations or bath installations having rotating transport and contact structures along the conveyor belt. The current is fed to the material in the center, i.e. in the useful zone, thereby obtaining a layer thickness distribution which is at least as good as when the current is supplied from both edges. The invention further allows material of any formats of width and different contours to be electrolytically treated in any order.
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