CIRCUIT BOARD STRUCTURE WITH LOW CAPACITANCE
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United States of America Patent
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Issued Date -
Mar 15, 2012
app pub date -
Sep 15, 2010
filing date -
Sep 15, 2010
priority date (Note) -
Abandoned
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Abstract
A circuit board structure, comprising: a first metal layer, including at least one cavity; and a plurality of first pads, for connecting at least one differential signal transmission line; wherein at least part of a vertical projection of the first pad, which is projected on the first metal layer, is overlapped with the cavity.
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