Gas Sensor Assembly with Interior Heat Dissipation, Sealing, and Support Plug
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United States of America Patent
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Issued Date -
Mar 8, 2012
app pub date -
Sep 1, 2011
filing date -
Sep 3, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A gas sensor assembly including a substrate located in a housing. The substrate includes a high temperature gas sensor end and a lower temperature electronics end. A heat transfer, sealing, and support plug is mounted in the housing to the substrate. The plug seals the sensor end from the electronics end and transfers the heat generated at the high temperature sensor end successively through the substrate, the thermally conductive plug, the housing, and into the outside air. In one embodiment, the housing includes a collar which surrounds a portion of the substrate and is coupled to and supported on one end of the plug and a jacket which surrounds the electronics end of the substrate and includes a neck coupled to and supported on an opposite end of the plug.
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