Pattern Verification Method, Pattern Verification System, Mask Manufacturing Method and Semiconductor Device Manufacturing Method

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United States of America Patent

SERIAL NO

13289630

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Abstract

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A pattern verification method comprising preparing a desired pattern and a mask pattern forming the desired pattern on a substrate, defining at least one evaluation point on an edge of the desired pattern, defining at least one process parameter to compute the transferred/formed pattern, defining a reference value and a variable range for each of the process parameters, computing a positional displacement for each first points corresponding to the evaluation point, first points computed using correction mask pattern and a plurality of combinations of parameter values obtained by varying the process parameters within the variable range or within the respective variable ranges, the positional displacement being displacement between first point and the evaluation point, computing a statistics of the positional displacements for each of the evaluation points, and outputting information modifying the mask pattern according to the statistics.

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Patent Owner(s)

Patent OwnerAddress
KABUBHSIKI KAISHA TOSHIBATOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IZUHA, Kyoko Yokohama-shi, JP 48 579
KOTANI, Toshiya Machida-shi, JP 132 1419
NOJIMA, Shigeki Yokohama-shi, JP 55 501
TANAKA, Satoshi Kawasaki-shi, JP 959 10603

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