METHOD FOR MANUFACTURING CHIP PACKAGE
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United States of America Patent
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Issued Date -
Mar 1, 2012
app pub date -
Mar 23, 2011
filing date -
Aug 27, 2010
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing a chip package includes exposing a ground ring out of encapsulating material in a direct or indirect way and forming a conductive film electrically connected to the ground ring so as to form an EMI shield and prevent external EMI. The present invention also massively forms conductive film for package structure for lowering the complexity and cost of manufacturing processes.
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