BALL GRID ARRAY PACKAGE
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United States of America Patent
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N/A
Issued Date -
Mar 1, 2012
app pub date -
Aug 30, 2010
filing date -
Aug 30, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A BGA package comprises a substrate, a chip disposed on the substrate, and a plurality of solder balls disposed under the substrate. The substrate further has a plurality of ball pads and a solder mask having a plurality of openings to expose the ball pads where the ball pads include two or more non-signal pads. Solder mask further has a trench connecting the ones of the openings on the non-signal pads where the trench is filled with solder paste so that the solder balls bonded to the non-signal pads are electrically connected together to achieve power integrity and to reduce numbers of power/ground layers to make the package thinner and the substrate cost lower.
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