LABEL FOR IN-MOLD MOLDING
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United States of America Patent
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Issued Date -
Feb 16, 2012
app pub date -
Jan 26, 2010
filing date -
Jan 30, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A label for in-mold molding, which comprises a laminate configuration of a substrate layer and a heat-sealable layer, wherein the substrate layer is a stretched film formed of a resin composition comprising an α-olefin-based copolymer having a melting point of from 105 to 170° C. and a crystalline propylene-based resin, and the label has an internal haze of from 1 to 30% for a stack of ten labels, does not detract from the shape of a container and does not detract from the outward appearance of the label when the label is stuck to the container.
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